Trace Laboratories | Capabilities | RELIABILITY / DURABILITY

Trace Newsletter - June 2009
Trace Newsletter - June 2009

Thermal Residue Fingerprinting: A Revolutionary Approach to Develop a Selective Cleaning Solution
During the last 5 years, the processes to remove flux residues especially for lead-free and challenging geometries have demonstrated new cleaning obstacles which have to be overcome. A new methodology has been recently developed to further increase the propensity for successful cleaning. At the core of this method is the thermal identification of the residue matrix. Thermal energy changes the physical state, i.e. transitions between liquid, solid and gas phases. By taking advantage of such specific information during phase transitions, the cleaning process can be tailored to such settings, which in turn increases the cleaning success significantly.

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Trace Laboratories is accredited by the leading standards institutes.
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Wastewater and Drinking Water Sampling and Analysis

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www.tracewatertesting.com

RELIABILITY / DURABILITY

Trace Labs conducts product qualification testing to MIL, SAE, ISO, IEC, IPC, ANSI, UL, to name a few. We also use your product's specific requirements and can assist you with writing your own test plan.

Product reliability can save money. We can conduct reliability tests for marketing purposes, we can design and build holding and fatigue testers and we can provide failure analysis services if necessary. Our durability equipment can measure your product's parameters during operation. We can measure voltage, resistance, temperature, force, strain, torque, elongation, etc. during operation.

Typical durability tests involve product operation under environmental simulation such as:

Push/pull
On/off
Open/close
Twist
Insertion/removal

We can monitor your product's output parameters while under environmental and physical stress. One major reliability test for printed circuit boards is High Density Interconnect (HDI) testing.

High Density Electronic Interconnect Testing

In today’s world, High Density Interconnect (HDI) device packaging is becoming more popular and more complex. Current applications include surface mount BGA (Ball Grid Array), SOP (Small Outline Package), CSP (Chip Scale Package), and FCLGA (Flip Chip Land Grid Array). Most of these applications continue to shrink in size while they continue to grow in I/O count.

Trace Labs subjects the packaging to accelerated or extreme environments to determine product reliability. Typical exposures consist of:

Thermal Cycling
Vibration
Mechanical Shock
Thermal Shock
Accelerated Life Test
Custom Cycling Chambers

Trace Provides:

High-speed Event Detection Monitors
Statistical Analysis (Such as the Engelmaier-Wild Model of the Weibill Distribution)
Resistance Data Logging Monitors

Trace Laboratories is internationally recognized and accredited for its capabilities with regard to the testing and monitoring of high density electronic interconnects; i.e., BGAs, CSPs, flip chip, and next generation electronic packages and assemblies. We can provide testing to IPC-9701, EIA, or internal company specifications.

Board Level Reliability

Three Point Bend Testing
Mechanical/Cyclic Fatigue
Vibration/Shock/Drop
Event Detection Monitoring
Resistance Monitoring
SEM/EDS
Microsection
Dye and Pry
HALT
HASS/Pressure Testing
Electrical/EMC
ESS and Others

High Density Interconnect Industry Specifications

Trace Laboratories conducts testing on high density electronic interconnect assemblies in accordance with numerous industry and original equipment manufacturer specifications, including IPC, Military, EIA, IEC, JEDEC, ASTM, UL, Telcordia, and numerous OEM specifications.

View our complete list of RELIABILITY / DURABILITY services and capabilities.