Trace Laboratories | Capabilities | LEAD FREE / TIN WHISKER

Trace Newsletter - June 2009
Trace Newsletter - June 2009

Thermal Residue Fingerprinting: A Revolutionary Approach to Develop a Selective Cleaning Solution
During the last 5 years, the processes to remove flux residues especially for lead-free and challenging geometries have demonstrated new cleaning obstacles which have to be overcome. A new methodology has been recently developed to further increase the propensity for successful cleaning. At the core of this method is the thermal identification of the residue matrix. Thermal energy changes the physical state, i.e. transitions between liquid, solid and gas phases. By taking advantage of such specific information during phase transitions, the cleaning process can be tailored to such settings, which in turn increases the cleaning success significantly.

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LEAD FREE / TIN WHISKER

Trace is an industry leader in lead-free product testing. Trace tests products that are expected to be in compliance to the European RoHS (Restriction of the Use of Certain Hazardous Substances) directive. This directive calls for the elimination of lead (Pb) in all electronic components in European product supply chains by July 1, 2006. Other countries, including the US, are expected to quickly follow suit.

Trace's lead-free testing program incorporates the iNEMI (International Electronics Manufacturing Initiative) specification for the testing of lead-free components. This testing helps to determine the extent of certain problems associated with lead-free products, including one of the more major concerns being Tin Whisker growth.

Tin Whiskers
With the use of tin (Sn) as a major component of lead-free solder, Tin Whiskers can develop. Tin Whiskers are growths that develop out of tin surfaces. The growths can cause short circuits or functional damage to another part of the product. Tin Whiskers occur in the following conditions:

Ambient room conditions (~25° C, 50 to 80% RH).
Some tests have shown that whiskers will not grow at temperatures exceeding 90°C.
Some tests have indicated that "Bright" tin may create whiskers faster than "matte" tin.

Testing
(Some Tests to be Conducted Concurrently)

Initially examine each of the pads/leads/joints for tin whiskers
Perform scanning electron microscopy
Photograph at approximately 3000x
Tin whisker accelerated test project
Isothermal tests
Thermal cycling test
Assembly, pre-conditioning, and providing of an electrical bias representing actual use conditions
High temperature/humidity aging test for 4000 hours
A storage test at ambient conditions for 4000 hours
A rapid thermal cycling test for 1000 cycles

Trace Labs is capable of meeting all lead free applications as specified by iNEMI.

Trace Laboratories' program will inspect using certified optical equipment. Complete written reports are available as part of the certified Tin Whisker testing program. Failure Analysis is available through our Trace Laboratories East facility.

Testing for Presence of Lead
This series of tests confirms that materials are truly lead-free. The test is done on the solder before product assembly. The metal is digested in acid and tested with atomic absorption spectroscopy (AAS) or Inductively Coupled Plasma (ICP).

Mechanical Strength
This test examines the integrity of lead-free solder joints.

Lead Pull Strength
Lead Shear Strength
Cross sectioning the joints
Energy Dispersive X-Ray Spectroscopy (EDS)
SEM

Trace Also Tests for These Common Lead-free Product Defects:

Poorly optimized lead free wave soldering
Non-wetting
Insufficient solder
De-wetting
Icicling
Cold solder joints
Blow holes
Solder balls/capillary balls
Fillet lifting
Skips
Grainy joints

For more information on Lead Free Product Testing or Tin Whisker Testing, please request a quote or contact us.

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