NewsRoom

Posted 3/17/2014, Written By: James Karayinopulos
Trace Labs and Hunt Valley Inn Electronics Testing Seminar

Attendees from around the United States learned about the latest trends in the electronics testing industry on April 15 in Baltimore, MD from a variety of industry professionals. The seminar was hosted at the Hunt Valley Inn. View the agenda!


Posted 1/27/2014, Written By: James Karayinopulos
SMT Magazine Front Cover Featuring Trace Labs Corrosion Article for NewsRoom

Read "Addressing Flux Corrosion and Reliability Concerns Early" by Renee Michalkiewicz, General Manager of Trace Labs, Baltimore as featured on the front cover of SMT Magazine’s January 2014 Reliability issue, or peruse the entire SMT Magazine. This publication is part of the I-Connect007's family of Electronics Packaging Industry magazines, founded in 1999, with over 30,000 news items and articles published.


Posted 1/27/2014, Written By: John Radman
Trace Labs IPC Failure Analysis Course

At IPC APEX 2014, John Radman, Senior Technical Director at Trace Labs, was the instructor for the Professional Development Course, "Failure Analysis Process for Printed Boards and Assemblies."


Posted 1/15/2014, Written By: Kevin Mehaffey
New Solar Radiation Capabilities with Q-Sun XE-3 Xenon Arc Chamber

Trace Laboratories has recently expanded its testing capabilities to perform Solar Radiation testing. The equipment is capable of time compressing long-term, real-life exposures of sunlight into a few days or weeks of chamber usage. Typically used to test outdoor-based products and material, the testing explores...

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Trace Presents Flux Corrosion at IPC

Posted 11/21/2013, Written By: Renee Michalkiewicz

Renee Michalkiewicz, General Manager at Trace Labs, presented during the IPC Conference on Solder and Reliability in Costa Mesa, California on November 14, 2013. View her IPC PowerPoint presentation to learn about: 1) testing soldering fluxes, 2) a new potential corrosion test for the 004 spec, 3) the importance of assembly process validation, and 4) a review of corrosion-induced failures and ways to reduce this risk.

See it here.


Featured Documents

Dye-n-Pry Example Showing Partially and Fully Separated Solder Joints at the IMC Layer

Dye-n-Pry Analysis is a simple but effective tool in determining the failure mode of surface mount components.  While it can be used on various component types and packages, it is particularly effective in examining ball grid array (BGA) components where a majority of the solder joints cannot be visually examined. While it is destructive in nature, Dye-n-Pry provides several advantages for the analyst...


View this IPC PowerPoint presentation to learn about: 1) testing soldering fluxes, 2) a new potential corrosion test for the 004 spec, 3) the importance of assembly process validation, and 4) a review of corrosion-induced failures and ways to reduce this risk. Renee Michalkiewicz, General Manager at Trace Laboratories, Inc., presented this information at IPC in Costa Mesa, CA on November 14, 2013. Watch this Dendrite Video after viewing the presentation!




Need an immediate increase in reliability? Is your product robust but you want complete confidence that everything has been done to minimize your field failures? Environmental Stress Screening (ESS) is the path for you. ESS is a...